Senior / Engineer (Wafer Bumping R&D)

Posted 26 Oct, 2021

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Job Description
  • To provide guidance for a team of process engineers in setup, qualification and production ramp up activities
  • Responsible for setting up critical bumping recipe at PVD and Lithography process
  • In-charge of lot dispositions and OCAP (Out-of-control Action Plan) executions for any deviating material.
  • Lead continuous improvement projects & device qualifications using APQP approach.
  • Working with QM (Quality Management Department on customer inquiries and issues responses.
  • Execute CIP (Continuous Improvement Program) or project handling that contributes yield & cost efficiency improvement
  • Ensure SPC (Statistical process Control) is maintain and in control
  • Lead on new material evaluation and new process parameter setup
  • To set up new devices and process according to customers requirements
  • To perform process development activities, line optimisation and cost control particularly at Dry processes (i.e. Photolithography)
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